MRICH: electronics/material budget

"concerning LAPPD material budget, Incom produces configurations with different window and base plate parameters. Here is one typical geometry, for a capacitively coupled device (assuming they are produced in a small 10x10 cm^2 form factor, required for mRICH):

window: 5mm borofloat glass (Wiki: 81% SiO2, 13% B2O3, 4% Na2O/K2O, 2% Al2O3), 2.23 g/cm^3

a pair of MCPs, 1.2mm each, assume the same glass material, with a fill-factor of ~1/4 -> take 0.3mm effective thickness per plate

anode base plate: 3.8mm of alumina (Wiki: Al2O3, 3.99 g/cm^3)

Other layers (multialkali PC, resistive layer, ALD coating) seem to be a small contribution. Not sure about the MCP electrodes, let's ignore them. There are ~8mm or so thick walls, ignore them too.

Now, of course in a pixelated configuration there will be a PCB of ~2mm or so thick on the rear side and (surprise!) the ASIC cards (~1000 channels per 10x10 cm^2 area -> say 16x densely packed small 64-channel PCBs, sticking out). I suspect they will require up to 10cm of extra space, as well as active cooling. Not sure about the overall material budget, but you get the idea."